当前位置:新锐科技 >> 芯片解密工程师专栏 >> 胡工芯片解密专栏 >> 浏览文章

W29GL032C单片机解密及IC技术分析

文章来源:www.voipdoor.net 作者:芯片解密 时间:2012年03月02日

  新锐科技芯片解密服务中心长期专业提供W29GL032C芯片解密/单片机解密等系列IC解密服务。依靠我们成熟的现成解密方案,丰富的实际解密经验以及对于解密过程的严格技术控制,针对客户的具体解密需求,我们能够最大限度确保解密的成功率和可靠性,且可最大限度降低解密周期及解密成本,为客户的总体项目开发提供最值得信赖的技术支持。

  W29GL032C特性

  ·32M-bit 3 Volt Parallel Flash Memory with Page Mode

  ·32k-Word/64k-Byte uniform sector architecture

  ·Hight(H)/Low(L) sector Protected

  ·Top(T)/Bottom(B) Boot Sector

  ·16-Word/32-Byte write buffer

  ·8-word/16-Byte page read buffer

  ·Secured Silicon Sector area

  ·Enhanced Sector Protect using Dynamic and Individual mechanisms

  ·Polling/Toggling methods are used to detect the status of program and erase operation

  ·Suspend and resume commands used for program and erase operations

  ·More than 100,000 erase/program cycles

  ·More than 20-year data retention

  ·Low power consumption

  ·Deep power down mode

  ·Wide temperature ranges

  ·Compatible manufacturer ID for drop-in replacement

  ·Faster Erase and Program time

  ·CFI(Common Flash Interface) support

  ·Single 3V Read/Program/Erase(2.7 - 3.6V)

  ·Enhanced Variable IO control

  ·#WP/ACC Input

  ·Ready/#Busy output(RY/#BY)detects completion of program or erase cycle

  ·PackageTSOP-56LFBGA-64TSOP-48TFBGA-48

  新锐科技长期针对W29GL032C单片机解密Winbond系列单片机提供优质解密服务,如果客户有W29GL032C单片机解密需求,请与我们联系咨询更多解密详情。